Company history



  • 1910 : Launched as an individual business by the first president, Genkichi Asami, in 59 Minami-inari-cho, Shitaya-ku, Tokyo
    (presently 2-3 Higashiueno,Taito-ku,Tokyo).
       
    1941 : The Japan Federation of Solder Tin Manufacturers Association was established along with other companies in the same business in Tokyo, Osaka, Nagoya, and Hokkaido, in compliance with instruction from the jurisdictional authorities.
    A collaborative workshop in the Tokyo region was located at the address where NIHON HANDA had been located before it moved to the site for Funabashi Plant in August 1977.
       
    1944 : Federations and associations were dissolved in compliance with the reform of the Ordinance for Enforcement of the Act on Commercial and Industrial Associations.
    NIHON HANDA Industry Co.,Ltd. was established.
       
    1952 : Started manufacturing RAPIDSOL (patented flux-cored wire solder).
       
    1965 : Became the first factory in the industry in Japan with certification from the Defence Agency for solders and flux complying with the (U.S.Federal) Military Specifications and Standards (MIL).
       
    1966 : The factory obtained JIS certification for all types of solders and flux-cored wire solders.
       
    1977 : Constructed a new factory in Narashino, Funabashi City and established the current Head Office sales department.
    Started mass production and sales of degassing solders (vacuum degassing solders).
       
    1983 : Constructed the second plant for degassing cream solders to start mass production and sales.
       
    1989 : Changed company name to "NIHON HANDA"Co.,Ltd."
       
    1993 : Developed DODENT (conductive adhesive) and started sales.
       
    1995 : Received the "Tanabe Invention Award" of the 20th Invention Awards for the development of a vacuum degassing solder. (The Japan Society For the Advancement of Inventions)
    Established the joint venture company NIHON HANDA Malaysia.
       
    1996 : Received an "Award from Director-General of the Science and Technology Agency" For the development of a vacuum degassing solder.
    Certified for the ISO 9001:1994 Quality System (Japanese Standards Association)
       
    2001 : Established the joint venture company NIHON HANDA Shanghai (factory and sales office) in Shanghai, China.
       
    2004 : Certified for the ISO14001:Environmental Management System. (Japanese Standards Association)
       
    2005 : Opened our Hong Kong Sales Office
       
    2007 : Established the Electronic Materials Laboratory in Anesaki-kaigan Ichihara.
       
    2008 : Obtained a new JIS certification for solders.
    Started the manufacturing and sales of metal adhesives (MAX Series)
       
    2010 : 100th anniversary
       
    2011 : Opened solder preformed factory in NIHON HANDA MALAYSIA
       
    2013 : Certified for the ISO9001:2008 Quality Management System in NIHON HANDA MALAYSIA
       
    2017 : Certified for the ISO9001:2015 Quality Management System in NIHON HANDA MALAYSIA
       
    2018 : Head office in Tokyo has moved